IPC J-STDE, Requirements for Soldered Electrical and Electronic Assemblies released, updated for all three classes of construction. Requirements for. Soldered Electrical and Electronic. Assemblies. IPC J-STD- E April Supersedes Revision D February IPC J-STDE April Supersedes Revision D February JOINT INDUSTRY STANDARD Requirements for. Soldered Electrical and Electronic.
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Minimize tirne to market? Contain simple simplified language? Just include spec information? Focus 00 end product performance? Th e TAEC recommends the use of the latest revision. Standards allow manufacturerscustomersand suppliers to understand ane another better.
Standards jj-std manufacturers greater e: There are many rounds of drafts sent out for review and the comrnittees spend hundreds of hours in review and developmen t. If your company buys lPC standards and public. For more information on membership in lPCplease visit www. It is not possible 10 in cJ ude all of those who assisted in the evolution of this standard.
Foster Defense Acquisition Inc. Training Consulting and Trade A.
Liu YunjiHuawei Technologies Co. J 2 Heat Shrinkable Soldering Devices Historically, electronic assembly solderi ng standards contained a more comprehensive tutorial addressing principles and techniques.
The intent of this document is to rely on process control methodology to ensure consistent qu a1 ity levels during the manufacture of products. The user see 1. The product class should be stated documentation package. Celsius is used to express temperature.
Weight is expressed in grams 1. Text takes precedence over the figures.
Not all process indicators specified by this standard are noted. It is the responsibi Ji ty of the manufacturer see 1. In the event of conflict between the requirements of this standard and an assembly drawing s ldocumentation that has not been user approvedthis standard govems.
The likelihood of criteria not aligning increases when different revisions are used together. The user 010e has the responsibility to specify acceptance criteria.
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
If no criteria is specifiedrequiredor citedthen best manufacturing practice applies. Insulating material needs to provide sufficient electrical isolation. J-atd otherwise specified the requireme nts of this standard are not imposed on the procure ment of co mmercial.
Jf the assembly is manufactured by the same manu fac turer, the solder requiremen ts are as stated in 001f contract for the entire assembly Personnel Jstd A lI instructors, operators, and inspcction person ne!
Supervised on-the-job training is acceptable unti! To provide for per sonnel safety, follow the applicable local and Federal OccupationalSafety and Health Regulations? The acceptance criteria shall [N1N] have user agreemen t. The external interconnect points e. J-wtd frequency of analysis should be determined on the basis of histo rical dataor monthly analyses. Records co ntain ing the resu! Maximum contaminatlon limits are applicable for Sn Other Lead-free solder alloy contamination limits may be used upon agreement between user and vendor.
Solder paste shall  also meet the requirements of 3. The material shall [D I] be cured 3. Components shall not  he charred Note: See Appendix A for guidelines on tool selec ti on and maintenance. For operator comfort and solderabil? Li ght ranges from 0 K enable users to distinguish various printed circuit assembly features and contaminates with increased clarity 4.
Follow the requirements of 001ee. Protection may be provided through a contro lIed heating process 4. Parts should be mounled such that part markings and reference designators are visib le see 9. AIJ leads shall  have stress relief when the component -jstd clip or adhesive mounted or otherwise constrained. Wires connected to terminals shall [AIP] have stress relie f.
Once parts are mounted on printed boards, the unsoldered assembly shall  be handledtranspOJ1ed e.
After soldering operations have been perfonmedlhe assembly shall [D I] be sufficienlly cooled so the solder is solidified prior to further handling 4. The preheat temperature exposure shall not  degrade printed boardscomponentsor soldering performance 4. If usedco ntrolled accelerated or slo wed ramp cooling shall [NI] be in accordance with documented procedures.
The solder bath temperaturebased on the solder alloy in useshall [NID2D3] be 0001e at a predetermined value with a tolerance of j: Dross shall [NIN2D3] be removed from the solder bath in a manner that assures that dross does not contact the items being soldered.
Automatic or j-sgd mcthods for dross removal are acceptable 4. The solder connections should have a genera Il y smooth appearance. Marks or scratchese.
These soldcr connections are acceptable Wetting ca nnot always be judged by surface appearance. The wide range of solder alloys in use may exhibit from low ol near zero degree contact angles to nearly contact angles as typica l.
Exposed basis metal shall not [D ID2D3] prevent the formation of an solder conn ecti on b. Fractured solder connecti ons b. Disturbed solder connections C.
Fails to comply with wetting criteria of 4. The design does not restri ct solder ft ow to any connection eleme nt on the solder destin ation side lands e. Wires overlap fo r at leasl 3 conductor diameters and 3re approximately parallel b.
The solder prefonn ring is centered over the splice fo llowing criteria shall c. Conductor contour is discernible.
J-STDE: Requirements for Soldered Electrical and Electronic Assemblies
Sleeving covers wi re insulation 00 both ends of the spliced area by a minimum of I wire di ameter f. No conductor strands piercing the sleeving. Meltable sealing rin g does not interfere with formation of req uired solder connection i. Insul ation shall not [DID2D3] have c uts, breaks, cracksor splits b. Chemical solutionspastes and creams used to strip solid wire shall [DID2D3] be neutralized or removed prior to soldering Note: Recommendations and requirements 00 wires used in high voltage applications are provided in 1.
No damaged strands for wires used at a potential for 6 kV or greater Note 2: Wires will be fo rmed for attachment to solder terminals b. The solder shall [NID2D3] wet the tinned portion of the wire and sho uld penetrate to the inner strands of the wire Solder build-up or ici c1 es within the tinned wire area shall not [DID2D3] affect subsequent assembly steps Stranded wires shall not [DID2D3] be tinned when a.
Wires will be used in crimp terminations b. Wires wi ll be used in threaded fasteners c. The shank of the terminal shall not [DID2D3] be perforated nor splitcrackedor otherwise damaged to the extenr that oilsfluxinksor other liquid substances utilized for processing the printed board can be entrapped within the mounting hole 5. Minimum elec tri cal clearance shall [DID2D3] be maintained and the ftare diameter should no l exceed the diameter of the land see Figure 5.
A printed foil land shall? Radial s plit 3 max 2. AFigure Terminal Mounting – Electrical 1. Pe rcentage 01 solde r source side land area covered with wetted solde r 5. T he clearance between the end of wire insulation and the solder of the connection is as follows a. The contour of the wires should not be obscured at the termination of the insulation b. Clearance shall [AIP] be two wire diameters incl uding insulation or 1.
No service loop 5. All leads shall  have stress j-sts when the component is clipped or adhesive mounted or otherwise constrained. A c urvature shall [DID2D3] be incl uded in the unwrapped wire portion j-ste the jumper to provide re lief of L e nsion from envi ro nmental loading.
For each intermediate bifurcated terminalthe wire passes through the s lot and is in contact with the base of the terminal or a previollsly installed Wlre c. Minimum electrical clearance req uirements shall [DID2D3] be met 5. Such mechanical securing should prevent movement between the parts of the connection during the solderi ng operatio n. Upper guide slol 2.
Lower guide slol 3. Base ‘ Accept Defect Wire violates minimum Defect electrica l clearance. Lead and wire ends may ex tend beyond the base of terminals provided the minimum electrical clearance is j-stf.